The **ATS-19F-04-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Fin Type** | XC-CUT (Cross-cut) | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS-19**: Refers to the specific product series (Push-pin heat sink). 2. **F**: Indicates the fin density/configuration. 3. **04**: Refers to the specific height/width variation in the catalog. 4. **C2**: Denotes the material and finish (usually Blue Anodized Aluminum). 5. **R0**: Indicates the revision level or packaging standard. --- ### 3. Key Electronic Cooling Features * **XC-CUT Fin Design:** The cross-cut pattern increases the surface area and allows for multi-directional airflow. This makes it more efficient in systems where the air direction might be irregular or turbulent. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides high pressure and a secure mechanical fit. This ensures better contact between the heat sink and the chip, improving thermal conductivity. * **Pre-Applied Thermal Material:** The "T766" coating is a phase-change material. When the component heats up, the material softens to fill microscopic air gaps, significantly reducing thermal resistance without the mess of manual thermal paste application. --- ### 4. Typical Applications This component is commonly found in: * **Network Switches/Routers:** For cooling ASICs. * **Embedded Systems:** Industrial PCs where vibration resistance (provided by push-pins) is required. * **Power Supplies:** Cooling voltage regulators or MOSFETs.