ATS-19F-10-C2-R0
AI

The **ATS-19F-10-C2-R0** is a specific electronic component known as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" series designed for efficient cooling of integrated circuits (ICs) and other electronic packages.
---
### 1. Technical Specifications
The part number follows a specific nomenclature that describes its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) with Spring |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Thermal Resistance** | Approx. 3.89 °C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
---
### 2. Physical Design Features
The "19F" series is characterized by its rectangular/square profile and high-performance fin geometry.
* **Straight Fins:** These are designed for **forced air convection** (using a fan). The gaps between the fins allow air to flow through and carry heat away from the base.
* **Push Pin Attachment:** This part uses a mechanical fastening system. Two or four holes are drilled into the PCB, and the brass pins lock the heat sink securely against the chip.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that improves heat transfer between the chip and the aluminum base.
---
### 3. Part Number Breakdown
Understanding the code helps in identifying the exact variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **19F** | Series/Geometry Designation |
| **10** | Specific Fin Configuration/Length code |
| **C2** | Finish Type (C2 usually denotes Blue Anodized) |
| **R0** | Revision or Packaging code |
---
### 4. Common Applications
This part is commonly used in industrial and consumer electronics where chips generate significant heat:
* **CPUs/GPUs:** Small form factor processors.
* **FPGAs:** High-speed field programmable gate arrays.
* **Telecommunications:** Network switches and routers.
* **Power Supplies:** Cooling voltage regulators or power transistors.
---
- ⤷What is the difference between push-pin and adhesive heat sink mounting?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can I reuse this heat sink if I remove it from a board?