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  • ATS-19F-10-C2-R0

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    The **ATS-19F-10-C2-R0** is a specific electronic component known as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" series designed for efficient cooling of integrated circuits (ICs) and other electronic packages. --- ### 1. Technical Specifications The part number follows a specific nomenclature that describes its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Spring | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | Approx. 3.89 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Features The "19F" series is characterized by its rectangular/square profile and high-performance fin geometry. * **Straight Fins:** These are designed for **forced air convection** (using a fan). The gaps between the fins allow air to flow through and carry heat away from the base. * **Push Pin Attachment:** This part uses a mechanical fastening system. Two or four holes are drilled into the PCB, and the brass pins lock the heat sink securely against the chip. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that improves heat transfer between the chip and the aluminum base. --- ### 3. Part Number Breakdown Understanding the code helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **19F** | Series/Geometry Designation | | **10** | Specific Fin Configuration/Length code | | **C2** | Finish Type (C2 usually denotes Blue Anodized) | | **R0** | Revision or Packaging code | --- ### 4. Common Applications This part is commonly used in industrial and consumer electronics where chips generate significant heat: * **CPUs/GPUs:** Small form factor processors. * **FPGAs:** High-speed field programmable gate arrays. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling voltage regulators or power transistors. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between push-pin and adhesive heat sink mounting?
    • ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ Can I reuse this heat sink if I remove it from a board?