ATS-19F-100-C2-R0
AI

The **ATS-19F-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat-density integrated circuits.
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### 1. Technical Specifications
The part number encodes specific physical and material properties:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 0.96°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height** | 25.00mm |
| **Pressure Drop** | 0.25 (at 200 LFM) |
---
### 2. Key Design Elements
#### A. maxiFLOW™ Fin Geometry
Unlike standard straight-fin heat sinks, this part uses a **tapered fin design**. This increases the surface area for heat dissipation while maximizing airflow through the fin field, reducing "stagnant air" zones.
#### B. pushPIN™ Attachment
The "R0" suffix refers to the attachment mechanism. It uses a **pushPIN™** system which includes:
* **Compression Springs:** Provides specific pressure to the TIM (Thermal Interface Material) for better heat transfer.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
This specific model usually comes with **ATS-CP-V44** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base.
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### 3. Application Use Cases
The ATS-19F-100-C2-R0 is typically used in environments where vertical space is available (25mm height) and active airflow (forced air/fans) is present.
* **Networking Gear:** Routers, switches, and base stations.
* **Industrial PCs:** High-load embedded systems.
* **Power Electronics:** Voltage regulators and high-speed processors.
---
### 4. Part Number Breakdown
```text
ATS - 19 F - 100 - C2 - R0
| | | | | |
| | | | | └─ Attachment/Revision Code
| | | | └────── Thermal Performance/Finish (Blue Anodized)
| | | └──────────── Height Code (100 = 25.0mm)
| | └───────────────── Fin Pattern (F = Fine)
| └─────────────────── Family Series
└───────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the difference between blue anodized and gold anodized heat sinks in terms of performance?
- ⤷ How do I calculate if the 0.96°C/W thermal resistance is sufficient for my 50W processor?
- ⤷ Does this heat sink require a specific PCB hole pattern for the pushPIN system?