Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19F-100-C2-R0

  • AI
    The **ATS-19F-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and material properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 0.96°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Pressure Drop** | 0.25 (at 200 LFM) | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heat sinks, this part uses a **tapered fin design**. This increases the surface area for heat dissipation while maximizing airflow through the fin field, reducing "stagnant air" zones. #### B. pushPIN™ Attachment The "R0" suffix refers to the attachment mechanism. It uses a **pushPIN™** system which includes: * **Compression Springs:** Provides specific pressure to the TIM (Thermal Interface Material) for better heat transfer. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) This specific model usually comes with **ATS-CP-V44** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base. --- ### 3. Application Use Cases The ATS-19F-100-C2-R0 is typically used in environments where vertical space is available (25mm height) and active airflow (forced air/fans) is present. * **Networking Gear:** Routers, switches, and base stations. * **Industrial PCs:** High-load embedded systems. * **Power Electronics:** Voltage regulators and high-speed processors. --- ### 4. Part Number Breakdown ```text ATS - 19 F - 100 - C2 - R0 | | | | | | | | | | | └─ Attachment/Revision Code | | | | └────── Thermal Performance/Finish (Blue Anodized) | | | └──────────── Height Code (100 = 25.0mm) | | └───────────────── Fin Pattern (F = Fine) | └─────────────────── Family Series └───────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and gold anodized heat sinks in terms of performance?
    • ⤷ How do I calculate if the 0.96°C/W thermal resistance is sufficient for my 50W processor?
    • ⤷ Does this heat sink require a specific PCB hole pattern for the pushPIN system?