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  • ATS-19F-102-C2-R0

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    The **ATS-19F-102-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.24°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (H)** | 25.00mm | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System This part utilizes a specialized push-pin mechanism. Unlike adhesive-based heat sinks, this uses a brass or plastic pin with a high-tension spring. * **Consistency:** Provides uniform pressure across the interface for better thermal transfer. * **Reliability:** Resistant to vibration and thermal expansion cycles. ### B. "mini-fan" Fin Design The fin geometry is optimized for "Fine Pitch" airflow. This allows for a larger surface area within a small footprint, maximizing the heat dissipation through convection. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the pre-applied thermal material. * **Type:** T766 (High performance) * **Function:** Fills microscopic air gaps between the heat sink base and the electronic chip to lower thermal impedance. --- ## 3. Application Use Cases This component is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Embedded systems requiring passive or active forced-air cooling. 3. **Power Electronics:** Cooling MOSFETs or IGBT modules. --- ## 4. Design Considerations When integrating this part into a PCB design, engineers must account for: * **Hole Pattern:** The PCB must have pre-drilled holes matching the 38mm x 38mm pitch. * **Airflow Direction:** Performance varies significantly based on Linear Feet per Minute (LFM) of airflow provided by system fans.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks besides push-pins?
    • ⤷ How does the 'Blue Anodized' finish affect thermal radiation?
    • ⤷ What is the difference between the C1 and C2 thermal interface materials in this series?