ATS-19F-102-C2-R0
AI

The **ATS-19F-102-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors.
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## 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-pin (Spring-loaded) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 2.24°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 45.00mm x 45.00mm |
| **Height (H)** | 25.00mm |
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## 2. Key Component Features
### A. pushPIN™ Attachment System
This part utilizes a specialized push-pin mechanism. Unlike adhesive-based heat sinks, this uses a brass or plastic pin with a high-tension spring.
* **Consistency:** Provides uniform pressure across the interface for better thermal transfer.
* **Reliability:** Resistant to vibration and thermal expansion cycles.
### B. "mini-fan" Fin Design
The fin geometry is optimized for "Fine Pitch" airflow. This allows for a larger surface area within a small footprint, maximizing the heat dissipation through convection.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the pre-applied thermal material.
* **Type:** T766 (High performance)
* **Function:** Fills microscopic air gaps between the heat sink base and the electronic chip to lower thermal impedance.
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## 3. Application Use Cases
This component is typically found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Industrial PCs:** Embedded systems requiring passive or active forced-air cooling.
3. **Power Electronics:** Cooling MOSFETs or IGBT modules.
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## 4. Design Considerations
When integrating this part into a PCB design, engineers must account for:
* **Hole Pattern:** The PCB must have pre-drilled holes matching the 38mm x 38mm pitch.
* **Airflow Direction:** Performance varies significantly based on Linear Feet per Minute (LFM) of airflow provided by system fans.
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What are the alternative attachment methods for ATS heat sinks besides push-pins?
- ⤷ How does the 'Blue Anodized' finish affect thermal radiation?
- ⤷ What is the difference between the C1 and C2 thermal interface materials in this series?