The **ATS-19F-115-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" thermal management series. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 5.33 °C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (High Efficiency) | --- ### 2. Component Breakdown This part is composed of three primary electronic-mechanical sub-sections: * **Heat Sink Body:** Designed with a fine-pitch fin structure to maximize surface area for heat dissipation. The 25mm height allows it to fit in mid-profile enclosures while handling significant thermal loads. * **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical plastic pin and a stainless steel spring. This ensures constant, uniform pressure on the electronic chip (IC), which optimizes heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal grease, ensuring a low-resistance path between the component and the heat sink. --- ### 3. Common Applications In the electronics industry, this part is typically used to cool the following components: 1. **CPUs and GPUs:** In embedded systems or industrial PCs. 2. **FPGAs/ASICs:** In telecommunications equipment where high heat density is common. 3. **Power Electronics:** Motor drivers or power converters requiring active or passive cooling. --- ### 4. Part Number Decoding (Nomenclature) Understanding the "ATS-19F-115-C2-R0" string: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **19:** Series designation. * **F:** Fin Type (Fine). * **115:** Dimensional/Pitch code. * **C2:** Material/Thermal performance grade. * **R0:** Revision/Packaging code.