## Technical Overview: ATS-19F-128-C2-R0 The **ATS-19F-128-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing thermal management components directly to a Printed Circuit Board (PCB). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Category** | Passive Cooling / Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.91 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The unit is constructed from high-grade aluminum. The **straight-fin design** is optimized for forced-air cooling environments. The blue anodized finish is not just aesthetic; it provides surface protection and slightly improves emissivity. #### B. The Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, the "R0" designation typically implies a specific hardware configuration: * **Push Pins:** These are spring-loaded pins that go through pre-drilled holes in the PCB. * **Springs:** Provides consistent downward pressure (clamping force) on the high-power component (CPU, GPU, or FPGA), ensuring maximum thermal transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a uniform layer that fills microscopic air gaps between the heat sink and the component. --- ### 3. Performance Metrics Thermal performance varies based on the airflow (Linear Feet per Minute - LFM) within the system: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 2.91 | | **200** | 1.76 | | **300** | 1.35 | | **400** | 1.14 | --- ### 4. Typical Applications * **Processors (CPUs/GPUs):** Cooling mid-range integrated circuits. * **FPGAs:** Cooling large programmable logic devices. * **Telecommunications:** Cooling chips in routers and high-speed switches. * **Industrial Power Supplies:** Dissipating heat from power transistors.