The **ATS-19F-130-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits in high-airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 5.21 °C/W (Unducted @ 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Spring Type** | Stainless Steel (Compression) | | **Thermal Interface Material** | T766 (Pre-applied thermal paste) | --- ### 2. Key Electronic Features #### A. Thermal Management Design This part utilizes a **tapered fin design** (maxiFLOW™). Unlike standard straight fins, these are flared outwards. This increases the surface area and encourages more air to pass through the fin field, which reduces the temperature of the underlying semiconductor more efficiently. #### B. The pushPIN™ Attachment System The "130" in the part number refers to the specific attachment kit. This system provides: * **Constant Pressure:** A high-tension spring ensures that the heat sink maintains firm, even contact with the electronic component. * **Vibration Resistance:** Secure mounting that prevents the heat sink from shifting during transport or operation. * **Easy Installation:** Designed for quick assembly onto pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The **C2-R0** suffix indicates that the unit comes pre-applied with **T766 thermal phase change material**. * **Purpose:** It fills the microscopic air gaps between the heat sink base and the chip surface. * **Advantage:** Eliminates the need for manual thermal paste application, ensuring consistent thermal performance across manufacturing batches. --- ### 3. Common Applications This heat sink is typically found in the following electronic systems: 1. **Telecommunications:** Cooling high-speed switching and routing chips. 2. **Industrial PCs:** Maintaining safe operating temperatures in fan-cooled enclosures. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---