The **ATS-19F-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 3.60°C/W (at 100 LFM) | --- ### 2. Key Design Elements #### A. Fin Design (Fine Pitch) The "131" designation typically refers to the fin pattern. This heat sink uses a **cross-cut** or **straight fin** design (depending on the specific sub-series configuration) optimized for vertical or horizontal airflow. The increased surface area allows for efficient heat transfer to the ambient air. #### B. PushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system provides: * **Constant Pressure:** A brass or plastic pin with a high-performance spring ensures even contact between the heat sink and the component. * **Secure Mounting:** It requires pre-drilled holes in the PCB, making it resistant to shock and vibration. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with a **T766 Phase Change Material**. This fills the microscopic air gaps between the heat sink and the chip to maximize thermal conductivity. --- ### 3. Usage Context This specific size (35mm x 35mm) is commonly used for: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Compact motherboards where space is limited but cooling is critical. * **Embedded Systems:** Field Programmable Gate Arrays (FPGAs) and ASICs. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.60 | | 300 (1.5 m/s) | 2.00 | | 500 (2.5 m/s) | 1.60 |