The **ATS-19F-134-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is designed to provide low thermal resistance and high reliability in air-cooled electronic systems. --- ## Technical Specifications The following table details the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.44°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Pressure Drop** | 0.14 inH2O (at 200 LFM) | | **Regulatory** | RoHS and REACH Compliant | --- ## Key Components and Design Features ### 1. The pushPIN™ Attachment System Unlike standard adhesive tapes, this part uses the **pushPIN™** system. This consists of a high-tension spring and a pin that passes through pre-drilled holes in the PCB. * **Benefits:** Ensures consistent pressure (clamping force) across the thermal interface material (TIM), preventing air gaps and improving heat transfer. * **Spring Force:** Pre-calculated to prevent PCB warping while maintaining solid contact. ### 2. maxiFLOW™ Fin Geometry The fins are not straight rectangles; they are designed with a specific taper and spacing to: * Increase surface area without significantly increasing weight. * Reduce the "Pressure Drop," allowing air from system fans to pass through more easily. * Maximize air turbulence to strip heat away from the aluminum surface more efficiently. ### 3. Thermal Interface Material (TIM) The part number suffix typically indicates the inclusion of a pre-applied thermal material. * **C2:** Refers to the specific thermal performance grade (standard or high performance). * **R0:** Indicates the RoHS compliance and revision status. --- ## Applications This electronic part is typically found cooling mid-to-high power density components on PCBs, such as: * **FPGAs & ASICs:** High-speed processing units. * **Network Switches:** Where vertical space (15mm height) is limited. * **Power Supplies:** Cooling voltage regulators or power transistors.