The **ATS-19F-14-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Dimensions** | 50.00 mm x 50.00 mm | | **Height** | 20.00 mm | | **Thermal Resistance** | 9.97°C/W @ 100 LFM | | **Fin Pattern** | Straight Fin | --- ### 2. Key Components & Materials #### A. The Heat Sink Body * **Material:** It is made of **6063 aluminum**, which offers high thermal conductivity while remaining lightweight. * **Fin Style:** It features a high-density straight-fin design to maximize surface area for convective cooling. * **Finish:** The **Blue Anodized** finish is not just aesthetic; it improves surface emissivity and protects the aluminum from corrosion. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complicated screws, this part uses the ATS pushPIN™ system: * **Springs:** Provides a consistent "Pre-load" (pressure) against the chip to ensure a tight thermal interface. * **Pins:** Designed to snap into pre-drilled holes (usually 3.0mm) on the PCB. #### C. Thermal Interface Material (TIM) * The **"C2"** in the part number indicates that the heat sink comes pre-applied with **ATS-54 thermal grease**. * This material fills the microscopic air gaps between the component and the heat sink base to improve heat transfer. --- ### 3. Thermal Performance (Estimated) Thermal performance depends on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.97 | | 300 (1.5 m/s) | 3.13 | | 500 (2.5 m/s) | 1.84 | --- ### 4. Application Use-Cases * **Telecommunications:** Cooling of networking ASICs. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** High-voltage power modules that generate significant heat in a small footprint.