The **ATS-19F-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 25mm x 25mm | | **Height (Fin)** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.76°C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **TIM (Interface Material)** | T766 (High Performance Phase Change) | --- ### 2. Breakdown of the Part Number Electronic parts often follow a nomenclature that describes their features. Here is the breakdown for **ATS-19F-141-C2-R0**: * **ATS**: Prefix for Advanced Thermal Solutions. * **19**: Refers to the specific series or product line. * **F**: Likely indicates the attachment type or specific sub-category. * **141**: Numerical code representing the physical size and fin configuration. * **C2**: Indicates the finish (Blue Anodized) and the Thermal Interface Material (T766). * **R0**: Version or Revision code. --- ### 3. Key Features and Applications #### Features * **pushPIN™ Attachment:** Uses a spring-loaded push-pin mechanism that provides high pressure and ensures a secure fit on the PCB. * **Optimal Airflow:** The straight fin design is optimized for environments where there is a consistent directional airflow. * **Pre-Applied TIM:** Comes with T766 thermal interface material, which fills microscopic air gaps between the component and the heat sink for better heat transfer. #### Common Applications * **Networking Equipment:** Routers, switches, and modems. * **Industrial PCs:** Compact computing modules that generate significant heat in small enclosures. * **Power Supplies:** Regulating heat for voltage converters and power modules. * **Telecommunications:** Cooling of high-speed data processing chips. ---