The **ATS-19F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-19F-147-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Fin Style** | Straight Fin (Cross-Cut) | | **Thermal Resistance** | ~13.65°C/W (Unducted flow @ 200 LFM) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just aesthetic; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### B. The pushPIN™ Attachment System This specific model uses a **pushPIN™** mechanism instead of adhesive tape. This system consists of: * **Compression Springs:** Provide precise pressure to ensure maximum contact between the heat sink and the component. * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB to lock the assembly in place. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This is the "grey pad" on the bottom that melts slightly at operating temperatures to fill microscopic air gaps between the chip and the metal, significantly improving heat transfer. --- ### 3. Application and Usage This part is typically found in: * **Networking Gear:** Routers, switches, and base stations. * **Embedded Systems:** High-speed processors or FPGAs. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.30 | | 200 | 1.0 | 13.65 | | 500 | 2.5 | 9.75 |