ATS-19F-15-C2-R0
AI

The **ATS-19F-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The model name follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Component Type** | Heat Sink | Passive cooling component |
| **Series** | pushPIN™ | Uses a push-pin attachment mechanism |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion |
| **Dimensions** | 45mm x 45mm | Standard square footprint |
| **Height** | 10mm | Low profile design |
| **Thermal Resistance** | 26.30 °C/W (Unducted) | Performance at 0.5 m/s airflow |
| **Attachment Type** | Push-Pin | Spring-loaded plastic pins for PCB mounting |
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### 2. Key Design Features
### A. pushPIN™ Mounting System
The part utilizes the **pushPIN™** attachment system, which consists of a flexible spring and a plastic pin. This provides:
* **Constant Pressure:** Ensures the heat sink remains in firm contact with the component.
* **Ease of Assembly:** Can be installed manually or with basic tools.
* **Reliability:** Resistant to vibration and mechanical shock.
### B. Fin Geometry
The "F" in the part number often indicates a **Fine Pitch** or specific fin orientation. The straight fin design is optimized for:
* **Laminar Airflow:** Best used in systems with dedicated fans or forced air cooling.
* **Surface Area:** Maximizes the contact area between the metal and the surrounding air.
### C. Thermal Interface Material (TIM)
Usually, these parts come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base to minimize air gaps between the chip and the heat sink.
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### 3. Applications
This specific part is typically found in:
1. **Networking Hardware:** Routers, switches, and hubs.
2. **Industrial PCs:** Compact systems requiring low-profile cooling.
3. **Power Electronics:** DC-DC converters and voltage regulators.
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- ⤷
What is the exact thermal resistance of this part at higher airflow speeds (e.g.
- ⤷ 2.0 m/s)?
- ⤷ Does the ATS-19F-15-C2-R0 come with a pre-applied thermal interface material?
- ⤷ What is the weight of this heat sink in grams?