The **ATS-19F-162-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.62 °C/W (at 100 LFM) | | **Weight** | 65.5 grams | --- ### 2. Key Electronic Components & Design The "parts" of this assembly work together to ensure efficient heat transfer: #### A. The Heat Sink Body (Aluminum) * **Purpose:** Absorbs heat from the semiconductor device via conduction. * **Design:** The vertical fins increase the surface area exposed to the air, allowing for better heat dissipation through convection. #### B. pushPIN™ Attachment Mechanism * **Spring-loaded Bolts:** These ensure consistent pressure (clamping force) across the electronic component. This is critical for minimizing the air gap between the chip and the heat sink. * **Hardware:** It uses high-performance plastic or metal pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied Thermal Tape or Grease. * **Function:** This is the "bridge" between the electronic chip and the metal heat sink. It fills microscopic air gaps (which are insulators) to ensure maximum heat flow. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed networking switches. 2. **Industrial PCs:** Maintaining stability in embedded systems. 3. **Power Supplies:** Dissipating heat from voltage regulators and power MOSFETs. ---