The **ATS-19F-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Material** | Aluminum (Body), Copper (Optional Base variants) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.41°C/W (at 200 LFM) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 33mm | | **Finish** | Blue Anodized | --- ### 2. Physical Design & Construction * **Straight Fin Design:** The "164" series designation typically refers to a straight-fin geometry. This is optimized for **undirected airflow** or forced-air cooling systems where air is pushed through the fins. * **Blue Anodized Coating:** The blue surface treatment isn't just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiation cooling. * **pushPIN™ Attachment:** This model uses a tool-free push-pin mechanism. It includes a compression spring that provides precisely calculated pressure to ensure the heat sink remains in firm contact with the electronic chip. --- ### 3. Thermal Performance Analysis The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | ~4.12 | | **200 (1.0 m/s)** | ~2.41 | | **400 (2.0 m/s)** | ~1.75 | | **600 (3.0 m/s)** | ~1.40 | --- ### 4. Integration Considerations 1. **PCB Footprint:** Ensure your PCB has the corresponding holes for the 45mm x 45mm pitch required for the push-pin mounting. 2. **TIM (Thermal Interface Material):** This specific model usually comes pre-applied with a **Phase Change Material** or thermal tape to bridge the microscopic air gaps between the chip and the heat sink base. 3. **Clearance:** With a height of 33mm, it is considered a mid-profile heat sink. Ensure there is enough vertical clearance in your enclosure.