The **ATS-19F-169-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide maximum surface area for cooling electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass/Plastic pins with springs) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.71°C/W (at 1.0 m/s airflow) | | **Dimensions** | 45.00mm x 45.00mm x 10.00mm | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. This heat sink uses a high-aspect-ratio fin design which significantly increases the surface area compared to standard extruded heat sinks. This is critical for high-power electronics that generate concentrated heat. #### B. pushPIN™ Attachment System The part uses a specialized mounting system that includes: * **Precision Springs:** Ensure the correct pressure is applied to the electronic component (TIM compression). * **Hardware:** Available in brass or plastic pins for secure PCB mounting. * **Installation:** Designed for 4-hole PCB patterns to ensure stability and vibration resistance. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the electronic component (die/case) and the heat sink base, ensuring efficient heat transfer. #### D. Blue Anodized Finish The finish is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiation heat transfer and providing a protective layer against corrosion and electrical conductivity on the surface. --- ### 3. Common Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Compute:** Cooling small form factor processors or chipsets.