The **ATS-19F-17-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" line, designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The model number encodes specific characteristics about the part's physical and thermal properties: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (H)** | 12.00 mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | Approx. 15.44 °C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number Electronic parts follow a specific nomenclature. Here is the breakdown for the **ATS-19F-17-C2-R0**: * **ATS**: Prefix for Advanced Thermal Solutions. * **19**: Series/Size designation. * **F**: Fin Pitch/Type (Fine pitch). * **17**: Specific height/design iteration. * **C2**: Material/Finish (typically Aluminum with a specific Blue Anodized finish). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While it is a mechanical part, its role in an electronic system is critical for reliability: 1. **Thermal Management:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or MOSFET), allowing the surrounding air to carry away heat more efficiently. 2. **Passive Cooling:** It operates without moving parts, though it is often placed in the path of a system fan (Active Cooling) to improve performance. 3. **Mechanical Stability:** The `pushPIN™` system ensures consistent pressure on the thermal interface material (TIM), preventing gaps that cause overheating. --- ### 4. Typical Applications This specific size (35mm x 35mm) is commonly used on: * **Northbridge/Southbridge** chipsets on motherboards. * **BGA (Ball Grid Array)** processors in industrial computing. * **Network Switches** and high-speed routers. * **Power Supplies** where localized cooling is required for voltage regulators.