The **ATS-19F-172-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is part of the **maxiFLOW™** series, designed specifically to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.71 °C/W @ 1.0 m/s (unducted) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heat sinks, the maxiFLOW design features a **tapered fin** structure. This geometry increases the surface area while reducing pressure drop, allowing the component to dissipate more heat even when the cooling fan speed is low. #### B. pushPIN™ Attachment The part number suffix indicates the mounting hardware. The pushPIN™ system includes: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** To provide precise, uniform pressure on the electronic component (CPU, GPU, or FPGA), ensuring optimal thermal contact. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied to the base. This eliminates the need for manual application and ensures a consistent, thin layer between the heat source and the aluminum base. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic systems: * **Network Switches & Routers:** High-speed data processing components. * **Embedded Systems:** Industrial PCs where space is limited. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Cooling RF components and optical modules. ---