The **ATS-19F-173-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the **maxiFLOW™** series manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications Below is a detailed breakdown of the physical and thermal characteristics of this specific part number: | Specification | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | maxiFLOW™ | | **Dimensions (L x W)** | 41.00 mm x 45.00 mm | | **Height (H)** | 9.00 mm | | **Material** | Aluminum (typically anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~4.72°C/W (at 200 LFM) | | **Fin Style** | Tapered Fin Design (High spread) | --- ### 2. Design and Engineering Features #### **A. maxiFLOW™ Fin Geometry** Unlike standard extruded heat sinks, the **maxiFLOW™** design features a "flared" or tapered fin geometry. This increases the surface area for heat dissipation while maintaining a low pressure drop. This is critical for systems with high-density components where airflow may be restricted. #### **B. pushPIN™ Attachment System** The suffix in the part number indicates the use of the **pushPIN™** assembly. This system includes: * **Compression Springs:** Provides a specific, consistent pressure (preload) on the component to ensure optimal thermal interface contact. * **Flexible Mounting:** Designed to fit pre-drilled holes in the PCB, reducing the risk of the heat sink shifting during mechanical shock or vibration. #### **C. C2-R0 Suffix Meaning** * **C2:** Refers to the thermal interface material (TIM) or the specific finish. In this case, it usually signifies a **Blue Anodized** finish and the inclusion of a high-performance thermal pad or grease. * **R0:** Typically refers to the revision level or the standard packaging/compliance status (RoHS compliant). --- ### 3. Application Use Cases This specific heat sink is typically used in the following environments: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Computing:** Thermal management for SOCs (System on Chips) and FPGAs. 3. **Power Electronics:** Dissipating heat from MOSFETs or power modules. --- ### 4. Thermal Performance Comparison *Thermal resistance measured in °C/W (Lower is better).* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (Unducted) | 5.50 | | 200 LFM (Unducted) | 4.72 | | 500 LFM (Unducted) | 3.60 |