ATS-19F-174-C2-R0
AI

The **ATS-19F-174-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, designed for thermal management in electronic assemblies. It belongs to the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS).
### 1. Technical Specifications
Below are the primary technical parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 4.02°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Fin Pattern** | Fine Pitch (Straight) |
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### 2. Key Electronic Functions
In an electronic system, this component serves several critical roles:
* **Heat Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET), allowing air to carry away heat more efficiently.
* **Component Longevity:** By maintaining lower operating temperatures, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF) of semiconductor devices.
* **Vibration Resistance:** The "pushPIN" mechanism (represented by the "19F" and "C2" designators) provides a secure mechanical connection that resists vibration better than simple adhesive tapes.
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### 3. Part Number Breakdown
The nomenclature follows a specific logic used by ATS:
1. **ATS-19**: Series identifier (pushPIN™ Heat Sink Tos).
2. **F**: Fin Type (Fine-pitch profile).
3. **174**: Specific physical footprint and height configuration.
4. **C2**: Thermal Interface Material (TIM) type (typically indicates T766 or similar high-performance grease).
5. **R0**: Revision/Packaging code (Standard RoHs compliant).
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### 4. Thermal Performance Data
Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 4.02 | 2.11 | 1.70 | 1.48 |
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What are the different pushPIN attachment materials available for this series?
- ⤷ How do I calculate if the 4.02°C/W resistance is sufficient for my specific chip?
- ⤷ What are the recommended hole patterns for mounting this heat sink on a PCB?