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  • ATS-19F-174-C2-R0

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    The **ATS-19F-174-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, designed for thermal management in electronic assemblies. It belongs to the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Pattern** | Fine Pitch (Straight) | --- ### 2. Key Electronic Functions In an electronic system, this component serves several critical roles: * **Heat Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET), allowing air to carry away heat more efficiently. * **Component Longevity:** By maintaining lower operating temperatures, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF) of semiconductor devices. * **Vibration Resistance:** The "pushPIN" mechanism (represented by the "19F" and "C2" designators) provides a secure mechanical connection that resists vibration better than simple adhesive tapes. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic used by ATS: 1. **ATS-19**: Series identifier (pushPIN™ Heat Sink Tos). 2. **F**: Fin Type (Fine-pitch profile). 3. **174**: Specific physical footprint and height configuration. 4. **C2**: Thermal Interface Material (TIM) type (typically indicates T766 or similar high-performance grease). 5. **R0**: Revision/Packaging code (Standard RoHs compliant). --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 4.02 | 2.11 | 1.70 | 1.48 |
    ✨ Follow-up Questions
    • ⤷ What are the different pushPIN attachment materials available for this series?
    • ⤷ How do I calculate if the 4.02°C/W resistance is sufficient for my specific chip?
    • ⤷ What are the recommended hole patterns for mounting this heat sink on a PCB?