The **ATS-19F-176-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" thermal management line. --- ### 1. Technical Specifications This part is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power transistors. | Parameter | Specification | |:---|:---| | **Part Number** | ATS-19F-176-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 6.73 °C/W (at 100 LFM) | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### 2. Breakdown of the Model Number Advanced Thermal Solutions uses a specific nomenclature to describe their parts. Here is the breakdown for this specific model: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **19**: Series (indicates the specific pushPIN™ assembly type). * **F**: Fin Type (indicates specific geometry). * **176**: Dimensional code (refers to length/width/height profile). * **C2**: Color and Thermal Performance (indicates Blue Anodized finish). * **R0**: Revision/RoHS status (Lead-free compliance). --- ### 3. Key Features * **PushPIN™ Attachment:** The "pushPIN" design uses a flexible attachment system that provides a secure, vibration-resistant mount to the PCB. * **Pre-applied TIM:** It comes with **T766 thermal grease** pre-applied to the base, ensuring consistent heat transfer from the component to the sink without manual application. * **Compressed Springs:** The assembly includes stainless steel springs that provide a specific amount of downward pressure to ensure optimal contact with the heat source. * **High Airflow Compatibility:** The straight-fin design is optimized for environments with forced-air cooling (fans). --- ### 4. Implementation Example In a typical PCB design, this part is used to cool a 35mm square BGA package. The installation process follows this logic: ```markdown 1. Locate the mounting holes on the PCB (spaced 40mm apart for this series). 2. Align the pushPINs with the holes. 3. Apply downward pressure until the pins "click" or lock into place. 4. The spring-load ensures the T766 interface material is compressed evenly. ```