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  • ATS-19F-184-C2-R0

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    The **ATS-19F-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Key Specifications Below are the primary technical characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.14°C/W @ 200 LFM | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Physical Design and Functionality The design of the ATS-19F-184-C2-R0 focuses on efficient heat dissipation through several integrated electronic-mechanical features: * **Heat Dissipation:** The aluminum fins increase the surface area available for convective cooling. The 25mm height is optimized for mid-to-high profile airflow environments. * **Thermal Interface Material (T766):** It comes pre-applied with T766, a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance. * **Push-Pin Attachment:** This model uses a brass push-pin with a compression spring. This ensures a consistent, calibrated pressure (load) on the electronic component, which is critical for maintaining thermal contact without cracking the silicon die. --- ### 3. Applications This part is typically found in the following electronic sectors: * **Networking:** Switches, routers, and high-speed modems. * **Computing:** Embedded systems and industrial PC motherboards. * **Power Electronics:** Voltage regulators and high-density power modules. --- ### 4. Cooling Performance (Airflow Data) The effectiveness of this part varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 4.14 | | 300 | 2.38 | | 400 | 1.83 | | 500 | 1.55 |
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for this heat sink?
    • ⤷ Are there alternative spring tensions available for this specific size?
    • ⤷ How does the T766 interface material compare to standard thermal grease?