ATS-19F-184-C2-R0
AI

The **ATS-19F-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as processors, FPGAs, and ASICs.
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### 1. Key Specifications
Below are the primary technical characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 4.14°C/W @ 200 LFM |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
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### 2. Physical Design and Functionality
The design of the ATS-19F-184-C2-R0 focuses on efficient heat dissipation through several integrated electronic-mechanical features:
* **Heat Dissipation:** The aluminum fins increase the surface area available for convective cooling. The 25mm height is optimized for mid-to-high profile airflow environments.
* **Thermal Interface Material (T766):** It comes pre-applied with T766, a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance.
* **Push-Pin Attachment:** This model uses a brass push-pin with a compression spring. This ensures a consistent, calibrated pressure (load) on the electronic component, which is critical for maintaining thermal contact without cracking the silicon die.
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### 3. Applications
This part is typically found in the following electronic sectors:
* **Networking:** Switches, routers, and high-speed modems.
* **Computing:** Embedded systems and industrial PC motherboards.
* **Power Electronics:** Voltage regulators and high-density power modules.
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### 4. Cooling Performance (Airflow Data)
The effectiveness of this part varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 4.14 |
| 300 | 2.38 |
| 400 | 1.83 |
| 500 | 1.55 |
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What is the hole pattern required on the PCB for this heat sink?
- ⤷ Are there alternative spring tensions available for this specific size?
- ⤷ How does the T766 interface material compare to standard thermal grease?