The **ATS-19F-187-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Key Technical Specifications The part number contains specific encoded information regarding its size, material, and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Attachment Type** | Push-PIN (for secure board mounting) | | **Heat Sink Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 10.70 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Functional Electronic Components While it is a passive mechanical part, its design includes several critical "parts" that interact with the electronic assembly: * **Push-PIN Assembly:** Uses a brass or plastic pin with a compressed spring. This ensures constant **pressure** (clamping force) between the heat sink and the electronic chip, which is vital for efficient heat transfer. * **Fin Array:** The "cross-cut" fin design increases surface area. In electronics, this allows for better airflow (convection) to carry heat away from the semiconductor junction. * **Thermal Interface Material (TIM):** The C2 designation typically refers to the pre-applied T766 phase-change material. This fills microscopic air gaps between the component and the heat sink, acting as a conductive bridge. --- ### 3. Application in Circuitry This component is typically found in the following electronic environments: 1. **Embedded Systems:** Cooling high-speed processors on PCB boards. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Telecommunications:** Used on networking gear where vertical space is limited (due to its low 10mm profile). --- ### 4. Thermal Performance Overview Thermal resistance indicates how well the part moves heat away from the electronics. Lower values are better for high-power chips. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.70 | | 300 (1.5 m/s) | 4.56 | | 500 (2.5 m/s) | 3.20 | ---