The **ATS-19F-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in constrained airflow environments. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 1.58°C/W @ 200 LFM (Linear Feet per Minute) | | **Thermal Resistance (Static)** | 4.10°C/W @ Ducted Flow | | **Dimensions (L x W x H)** | 50mm x 50mm x 20mm | | **Footprint** | 50mm x 50mm | --- ## 2. Key Design Elements ### A. maxiFLOW™ Fin Design The "F" in the part number signifies the **maxiFLOW™** geometry. This design features a spread fin structure that increases the surface area while reducing pressure drop. It is particularly effective in systems with low-to-medium airflow because it draws more air into the fin array. ### B. pushPIN™ Attachment This model uses the **pushPIN™** mounting system. Unlike adhesive tapes, this mechanical attachment: * Ensures consistent pressure on the component (TIM - Thermal Interface Material). * Prevents the heat sink from shifting during vibration or shipping. * Uses a compression spring to maintain a secure fit without over-tightening. ### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves thermal emissivity (radiation cooling). --- ## 3. Part Number Breakdown Understanding the suffix codes: * **ATS-19**: Part series designation. * **F**: maxiFLOW™ fin style. * **199**: Specific size/geometry identifier. * **C2**: Material/Finish code (typically Aluminum with Blue Anodization). * **R0**: Revision or packaging code. --- ## 4. Applications This part is commonly used to cool high-heat dissipation electronic components such as: 1. **FPGAs & ASICs:** Used in networking hardware. 2. **Processors:** Embedded CPUs in industrial computers. 3. **Power Supplies:** Cooling MOSFETs or power modules.