The **ATS-19F-202-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are critical in cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Type** | Heat Sink (Push-Pin) | | **Heat Sink Type** | Straight Fin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Component Dimensions Precise physical measurements are vital for PCB layout planning to ensure no interference with surrounding surface-mount devices (SMDs). | Dimension | Value (mm) | | :--- | :--- | | **Base Length** | 54.00 mm | | **Base Width** | 54.00 mm | | **Height** | 15.00 mm | | **Hole Spacing** | 47.00 mm | --- ### 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink moves heat away from the semiconductor. * **Thermal Resistance (Unducted):** 14.83 °C/W @ 100 LFM (Linear Feet per Minute). * **Thermal Resistance (High Flow):** 4.12 °C/W @ 400 LFM. * **Pressure Drop:** The straight-fin design is optimized for low-pressure drop, allowing for efficient airflow even in densely packed enclosures. --- ### 4. Key Electronic Features * **T766 Thermal Interface:** The unit comes pre-applied with a thermal phase-change material, which fills microscopic air gaps between the component and the heat sink to maximize heat transfer. * **Push-Pin Attachment:** Features a flexible, spring-loaded mechanism that provides consistent pressure for thermal contact while allowing for thermal expansion/contraction. * **Non-Conductive Finish:** The blue anodized coating provides corrosion resistance and modest electrical insulation (though it should not be relied upon as a primary dielectric). --- ### 5. Implementation Example If you were documenting this part in a Bill of Materials (BOM) or a CAD library: ```yaml Part_Number: ATS-19F-202-C2-R0 Category: Thermal Management Mounting_Type: Through-hole (Pins) Material_Composition: - Body: Aluminum - Pin: Brass - Spring: Stainless Steel Thermal_Interface: Pre-applied T766 ```