The **ATS-19F-206-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.71°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Design Characteristics The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **19F**: Refers to the specific fin pattern and series geometry. * **206**: A code representing the dimensions and thermal performance characteristics. * **C2**: Indicates the material and finish (typically aluminum with a blue anodized coating). * **R0**: Refers to the revision and packaging (Standard RoHS compliant). ### 3. Key Electronic Components Features * **High Aspect Ratio Fins:** The heat sink utilizes a "Fine Pitch" or "Cross-Cut" design to maximize surface area for air interaction while maintaining a compact footprint. * **Push-Pin Mounting:** Unlike adhesive-only heat sinks, the "pushPIN™" system uses a flexible spring-loaded mechanism. This ensures consistent pressure across the component surface, which optimizes thermal transfer. * **Pre-Applied TIM:** It comes with **T766 thermal interface material** pre-applied to the base, reducing assembly time and ensuring a reliable bond between the heat source and the sink. * **Airflow Optimization:** The design is optimized for forced-air environments (using fans), though it can function in natural convection scenarios with significantly reduced efficiency. ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Voltage regulators and high-speed data converters. ---