The **ATS-19F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-207-C2-R0 | | **Product Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.39°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring there is no interference with surrounding components. * **Size (L x W):** 54mm x 54mm * **Height:** 10mm (Low profile) * **Pin Pitch:** 47mm (Distance between the mounting holes) --- ### 3. Electronic Design Considerations #### Thermal Performance This part is designed for "force-air" environments (systems with fans). Its performance is measured by **Thermal Resistance (°C/W)**; a lower value indicates better heat dissipation. As air velocity increases (measured in Linear Feet per Minute - LFM), the thermal resistance drops significantly. #### Attachment System (pushPIN™) Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. * **Spring-loaded mechanism:** Provides a consistent pressure (Pre-assembled with a compression spring) to optimize the interface between the heat sink and the chip. * **Reliability:** It is more secure than thermal tape in high-vibration or high-heat environments. #### Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. It is also non-conductive, though it should not be relied upon as an electrical insulator. --- ### 4. Typical Applications * **CPUs/GPUs:** Cooling low-power processors or graphics units. * **Telecommunications:** High-speed routers and switches. * **Industrial Power Supplies:** Cooling MOSFETs or power transistors. * **Embedded Systems:** Boards where vertical space is limited (due to the 10mm height).