The **ATS-19F-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" line, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ## 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 6.00mm | | **Thermal Resistance** | 10.50 °C/W (at 100 LFM) | | **Attachment Method** | Push Pin (with Spring) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features ### A. Low Profile Design With a height of only **6.00mm**, this heat sink is designed for "space-constrained" environments. It is ideal for slim enclosures, blade servers, or portable electronics where vertical clearance is limited. ### B. Fin Geometry The part utilizes a **straight-fin** or **cross-cut** design (depending on the specific batch variant). This geometry maximizes surface area while allowing air to flow through efficiently, even at low speeds. ### C. Attachment System (pushPIN™) The "pushPIN™" system consists of a plastic or brass pin and a stainless steel spring. * **Precision:** Ensures the correct amount of pressure is applied to the chip for optimal heat transfer. * **Ease of Use:** Allows for quick installation and removal without the need for specialized tools. * **Stability:** Provides a secure mechanical connection compared to simple adhesive tapes. --- ## 3. Thermal Performance (Estimated) Thermal resistance indicates how effectively the heat sink dissipates energy. A lower °C/W value is better. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.50 | | 200 | 1.0 | 6.29 | | 300 | 1.5 | 4.87 | | 400 | 2.0 | 4.10 | --- ## 4. Typical Applications This component is commonly found in the following electronic systems: * **Networking Hardware:** High-speed routers, switches, and modems. * **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **FPGA/CPU Cooling:** Passive or active cooling for large-surface-area chips. ---