The **ATS-19F-210-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W)** | 70.00mm x 70.00mm | | **Height** | 12.70mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 0.80°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### ### Key Electronic & Mechanical Features #### 1. Thermal Dissipation Performance The core electronic function of this part is to lower the junction temperature of a semiconductor. With a thermal resistance of approximately **0.80°C/W** under moderate airflow, it is highly efficient at preventing "thermal throttling" or hardware failure in high-speed processors. #### 2. pushPIN™ Attachment System Instead of using messy thermal adhesives or tapes that can degrade over time, this part uses a mechanical **Push-Pin** system. * **Precision:** It ensures even pressure across the electronic chip. * **Reliability:** The springs are pre-assembled to provide the exact required compression for optimal heat transfer. #### 3. Material Science (Aluminum & Finish) * **Aluminum 6063:** Chosen for its excellent balance of thermal conductivity and weight. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat loss. #### 4. Low Profile Design At only **12.70mm** in height, this component is designed for "thin" electronic enclosures where vertical space is limited, such as 1U rack servers or compact industrial PCs. --- ### ### Typical Application Circuitry This heat sink is commonly found protecting: * **ASICs and FPGAs:** Used in telecommunications and data centers. * **Power Modules:** High-current DC-DC converters. * **Embedded Systems:** Industrial motherboards requiring passive or semi-passive cooling. ---