The **ATS-19F-22-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ## 1. Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-22-C3-R0 | | **Heat Sink Type** | Push Pin (Spring-loaded) | | **Fin Type** | Blue Anodized Aluminum | | **Thermal Resistance** | 1.90°C/W @ 200 LFM | | **Attachment Method** | Push Pins (Plastic/Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. Material and Design * **Aluminum Construction:** Lightweight yet efficient at conducting heat away from the semiconductor die. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. * **Fin Geometry:** Optimized for vertical or horizontal airflow depending on the enclosure design. ### B. Thermal Management (C3 Classification) The "C3" in the part number refers to the **Thermal Interface Material (TIM)**. * This model comes with pre-applied **T766 phase-change material**. * **Benefit:** It eliminates the need for manual paste application, ensuring a uniform layer that fills microscopic air gaps between the component and the heat sink for maximum heat transfer. ### C. Mechanical Attachment * **Push Pin System:** Uses a spring-loaded mechanism that provides a specific, consistent pressure (clamping force) on the electronic chip. * **Reliability:** This method is preferred over adhesive tapes because it allows for thermal expansion and contraction without losing contact with the component. --- ## 3. Dimensional Data | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 45mm x 45mm | | **Height** | 15mm | | **Mounting Hole Pattern** | Specific to the push-pin spacing (refer to datasheet for precise layout) | --- ## 4. Typical Applications * **Network Switches:** Cooling high-speed processors. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where mechanical stability is required due to vibration.