The **ATS-19F-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Dimensions** | 35mm x 35mm | | **Height (Off Base)** | 10mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 25.25°C/W (Unducted) | | **Finish** | Blue Anodized | --- ### Key Electronic & Mechanical Components #### 1. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **T766**, a high-performance thermal phase-change material or grease. This ensures there are no air gaps between the heat-generating electronic component and the aluminum base, maximizing heat transfer. #### 2. Push-Pin Attachment Mechanism Instead of adhesive tapes, this part uses a mechanical push-pin system. This is critical for electronics that experience high vibration or require high mounting pressure to maintain thermal contact. * **Springs:** Provides consistent pressure. * **Pins:** Designed for 3.0mm or 4.7mm holes in the PCB. #### 3. Fin Design (Straight Fin) The straight fin geometry is optimized for **forced air cooling** (active cooling via a fan). The spacing between the fins allows air to flow through with low pressure drop, making it efficient for compact PCB layouts. --- ### Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs. * **Power Supplies:** Dissipating heat from voltage regulators. * **Telecommunications:** Cooling networking hardware inside chassis with directed airflow. ---