The **ATS-19F-33-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **maxiFLOW™** heat sink series, designed primarily for cooling BGA (Ball Grid Array) components. ### 1. General Specifications The part is a thermal management solution characterized by its high-density fin structure and attachment mechanism. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-33-C3-R0 | | **Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Interface Material (TIM)** | T412 | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits the PCB layout and the specific chip it is intended to cool. * **Length (A):** 36.83 mm * **Width (B):** 36.83 mm * **Height (C):** 17.78 mm * **Pitch (E/F):** 44.45 mm (Hole-to-hole spacing for the pins) --- ### 3. Key Electronic/Thermal Features #### A. The maxiFLOW™ Design The "F" in the part number denotes the maxiFLOW™ profile. This design features a spread fin structure that increases the surface area for heat dissipation while reducing pressure drop. This is ideal for environments with restricted airflow. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system. * **Mechanics:** Uses a brass or plastic pin with a high-tension spring. * **Benefit:** Provides consistent pressure on the processor, ensuring maximum thermal transfer and mechanical stability during vibration. #### C. Thermal Performance The performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.70 | | 400 (2.0 m/s) | 3.50 | | 600 (3.0 m/s) | 2.50 | --- ### 4. Material and Compliance * **Finish:** Blue Anodized (increases surface emissivity and provides corrosion resistance). * **RoHS Status:** Fully compliant (lead-free). * **Thermal Interface:** Pre-applied **T412** phase-change material, which fills microscopic air gaps between the chip and the heat sink. ---