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  • ATS-19F-35-C2-R0

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    The **ATS-19F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to cool electronic components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-35-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 4.88°C/W (at 200 LFM) | | **Dimensions** | 35mm x 35mm x 10mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features ### A. maxiFLOW™ Fin Geometry The heat sink features a unique tapered fin design. Unlike standard square fins, these are angled to maximize surface area while reducing pressure drop. This allows for better airflow through the sink even in systems with low-velocity air. ### B. pushPIN™ Attachment Instead of using messy adhesives or tapes, this model uses a mechanical **pushPIN™** system: * **Reliability:** Ensures consistent pressure on the processor. * **Security:** Prevents the heat sink from shifting due to vibration or shock. * **Hardware:** Includes a brass component and a stainless steel spring. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that ensures minimal air gaps between the heat sink and the electronic component (CPU/GPU/FPGA), facilitating efficient heat transfer. --- ## 3. Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.88 | | 400 (2.0 m/s) | 3.32 | | 600 (3.0 m/s) | 2.50 | --- ## 4. Typical Applications This specific part is typically used for: * **Telecommunications:** Cooling network switches and routers. * **Computing:** Protecting high-speed processors or FPGAs. * **Industrial Electronics:** Managing heat in power supplies and motor controllers.
    ✨ Follow-up Questions
    • ⤷ What are the specific mounting hole requirements for the pushPIN system on this model?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a natural convection environment without a fan?