The **ATS-19F-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Detail | | :--- | :--- | :--- | | **Part Number** | ATS-19F-36-C3-R0 | Standard Product Series | | **Material** | Aluminum | High thermal conductivity | | **Finish** | Blue Anodized | Corrosion resistance and emissivity | | **Attachment Method** | pushPIN™ | Spring-loaded mounting system | | **Dimensions** | 36.83 x 36.83 mm | Footprint size | | **Height** | 15.00 mm | Low-profile vertical clearance | | **Thermal Resistance** | ~14.90 °C/W (Unducted) | Varies based on airflow (LFM) | --- ## 2. Key Electronic Components ### The Fin Design The "F" in the part number indicates a **Fine Pitch** or specific fin geometry. These fins increase the surface area available for heat transfer. In this model, the fins are optimized for both natural convection and forced-air cooling. ### The pushPIN™ Attachment System Unlike simple adhesive tapes, the **R0** designation typically includes a robust mounting system: * **Compression Springs:** Provides precise pressure to ensure the thermal interface material (TIM) makes optimal contact with the chip. * **Plastic/Brass Push Pins:** Designed to lock into pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. ### Thermal Interface Material (TIM) While the heat sink itself is metal, the bottom surface usually comes pre-applied with a high-performance thermal pad or grease (e.g., **ATS-54**), which fills microscopic air gaps between the component and the heat sink. --- ## 3. Thermal Performance Metrics Thermal performance is measured by how much the temperature rises per watt of power dissipated ($^\circ\text{C/W}$). | Air Velocity (LFM) | Thermal Resistance ($^\circ\text{C/W}$) | | :--- | :--- | | 200 (1.0 m/s) | 5.76 | | 400 (2.0 m/s) | 3.62 | | 600 (3.0 m/s) | 2.88 | --- ## 4. Application Use Cases This specific size (roughly 37mm square) is commonly used for: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGA** (Field Programmable Gate Arrays) in industrial controllers. * **Telecommunications** equipment where space is limited but heat density is high.