The **ATS-19F-37-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table highlights the core technical parameters of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-19F-37-C2-R0 | | **Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.12°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 20.00mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The design of the ATS-19F-37-C2-R0 focuses on efficient heat dissipation within high-density PCB environments. * **Heat Sink Geometry:** It features a **Straight Fin** design. This allows air to flow through the fins efficiently, making it ideal for systems with directed airflow. * **Attachment System:** It utilizes the **push-pin** mechanism. This involves pre-drilled holes in the PCB where plastic pins with springs are inserted. This ensures consistent pressure on the component for maximum thermal transfer. * **Material:** Made from high-quality aluminum, which offers a balance between thermal conductivity, weight, and cost-effectiveness. The **Blue Anodized** finish provides corrosion resistance and improves thermal emissivity. --- ### 3. Thermal Performance Profile Thermal resistance is critical for preventing component failure. The performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 9.12 | | 200 (Moderate) | 4.83 | | 300 (High) | 3.52 | | 400+ (Extreme) | 2.82 | --- ### 4. Typical Applications The ATS-19F-37-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Protecting SoCs (System on Chips) in industrial computers. 3. **Power Electronics:** Managing heat for voltage regulators and power modules. ---