The **ATS-19F-40-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power modules to prevent thermal throttling or failure. --- ## 1. Component Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.61°C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm | | **Height** | 15mm | | **RoHS Status** | Compliant | --- ## 2. Key Design Features ### A. maxiFLOW™ Fin Geometry The "F" in the part number indicates the maxiFLOW™ design. Unlike standard straight fins, these heat sinks use a tapered fin design that increases the surface area while reducing pressure drop. This allows for maximum airflow efficiency across the component. ### B. pushPIN™ Attachment The `R0` suffix typically indicates the attachment hardware. This model uses a **pushPIN™** system which includes: * **Pre-drilled holes:** The heat sink is mounted via two holes in the PCB. * **Compression Springs:** Provides precise pressure to ensure optimal thermal interface contact. * **Plastic/Brass Pins:** Secure the unit to the board quickly without complex tools. ### C. Thermal Interface Material (TIM) This component usually comes with a pre-applied thermal interface material (like **T766**), which fills microscopic air gaps between the heat sink and the electronic chip to improve heat transfer. --- ## 3. Applications This part is commonly found in environments where space is limited but high heat dissipation is required: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and industrial PC motherboards. * **Power Electronics:** Voltage regulators and high-speed transistors. --- ## 4. Technical Performance Data Thermal resistance varies based on air velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.61 | | 300 (1.5 m/s) | 7.30 | | 500 (2.5 m/s) | 5.30 |