Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19F-47-C3-R0

  • AI
    The **ATS-19F-47-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series, designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Electronic Cooling Properties The efficiency of this part is measured by its thermal resistance (how much temperature rises per watt of power). * **Thermal Resistance (Low Airflow):** 9.32°C/W at 200 LFM (Linear Feet per Minute). * **Thermal Resistance (High Airflow):** 2.31°C/W at 800 LFM. * **Fin Pattern:** Straight fins, optimized for longitudinal airflow. --- ### 3. Component Breakdown The part number can be decoded to understand its specific construction: 1. **ATS-19**: Refers to the specific series of high-performance heat sinks. 2. **F**: Indicates the fin density/type (Fine pitch). 3. **47**: Refers to the footprint size/series identifier. 4. **C3**: Denotes the height and specific attachment hardware (Brass push pins). 5. **R0**: Refers to the version or packaging code (typically Blue Anodized). --- ### 4. Application Use Cases * **Telecommunications:** Cooling of high-speed network switches and routers. * **Embedded Systems:** Used on single-board computers that generate significant heat. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 5. Implementation Example If you were integrating this into a PCB design using a CAD tool (like Altium or Eagle), you would need to account for the hole pattern for the push-pins: ```text PCB Layout Requirements: - Hole Diameter: 3.0mm (Standard for ATS Brass Push-Pins) - Hole Spacing: Matches the 45mm x 45mm footprint diagonal - Keep-out Zone: No sensitive traces under the push-pin tension points ```
    ✨ Follow-up Questions
    • ⤷ What are the alternatives to push-pin mounting for this heatsink size?
    • ⤷ How does the T412 thermal interface material compare to high-end thermal paste?
    • ⤷ Can this heatsink be used for passive cooling without a fan?