The **ATS-19F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary technical parameters for the ATS-19F-49-C3-R0: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 26.38°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Pressure Rating** | Low Profile | --- ## 2. Component Breakdown ### A. Material and Coating * **Aluminum 6063:** Provides excellent thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases surface emissivity, which improves heat dissipation via radiation and protects the metal from corrosion. ### B. Geometry (Straight Fin) The "Straight Fin" design is optimized for **forced-air cooling** (environments with fans). The parallel fins allow air to flow through the channels with low pressure drop, effectively stripping heat away from the base. ### C. Attachment Mechanism (Push-Pin) This part uses a **Brass Push-Pin** with a **Steel Spring**. * **Ease of Assembly:** No tools are required for installation. * **Reliability:** The spring ensures constant pressure (clamped load) on the electronic component, which is critical for maintaining the integrity of the Thermal Interface Material (TIM) over time. --- ## 3. Performance Data (Airflow) Thermal performance varies based on the velocity of the air moving across the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 26.38 | | 400 (2.0 m/s) | 11.60 | | 600 (3.0 m/s) | 7.10 | | 800 (4.0 m/s) | 5.40 | --- ## 4. Usage Considerations When integrating this part into a PCB design, consider the following: 1. **Hole Pattern:** The PCB must have specific pre-drilled holes to accommodate the push-pins. 2. **TIM (Thermal Interface Material):** Always use a thermal pad or paste between the base of the heat sink and the component to eliminate air gaps. 3. **Clearance:** Ensure the 10mm height does not interfere with other components or the enclosure lid.