The **ATS-19F-54-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the device. | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | ~7.00 °C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 35mm x 35mm x 35mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Breakdown of the Part Number The part number can be decoded as follows: * **ATS**: Brand (Advanced Thermal Solutions). * **19**: Series identifier. * **F**: Fin Pitch/Type (often denotes a specific fin density). * **54**: Physical size/configuration code. * **C2**: Material/Finish code (Aluminum with Blue Anodized finish). * **R0**: Revision or specific packaging/mounting kit version. --- ### 3. Key Electronic/Mechanical Features #### A. Attachment Mechanism The "pushPIN™" system uses a flexible attachment method. It includes: * A pre-drilled hole pattern on the PCB. * A compression spring to provide uniform pressure across the thermal interface material (TIM). * This ensures maximum heat transfer by maintaining consistent contact between the sink and the chip. #### B. Thermal Performance This heat sink is designed for **forced air cooling**. In a system with a fan, the vertical fins allow air to pass through, stripping heat away from the aluminum surface. The thermal resistance decreases significantly as the Airflow (Measured in Linear Feet per Minute - LFM) increases. #### C. Environmental & Compliance * **RoHS Compliant:** Lead-free and environmentally safe. * **Material:** Lightweight aluminum allows for high thermal conductivity without adding significant weight to the PCB assembly. --- ### 4. Typical Applications * **Networking:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs or power modules.