### ATS-19F-55-C3-R0 Technical Overview The **ATS-19F-55-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed as part of their "push pin" series for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-55-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring Loaded) | | **Thermal Resistance** | 23.98 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | --- ### 2. Component Design Features #### A. Fin Geometry This model utilizes a **Straight Fin** design. Straight fins are optimized for systems where the airflow direction is consistent and predictable. This profile offers low pressure drop, making it ideal for high-velocity air environments. #### B. Thermal Interface Material (TIM) The "C3" suffix in the part number indicates the specific type of Thermal Interface Material pre-applied to the base: * **Material:** T766 (High performance, non-electrically conductive). * **Function:** Fills microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer. #### C. Push-Pin Attachment The **R0** designation refers to the attachment kit. The push-pin mechanism provides: * **Consistent Pressure:** Ensures the TIM is compressed correctly. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Assembly:** Quick installation into pre-drilled PCB holes. --- ### 3. Electronic Application Usage This component is typically used in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space (10mm height) is limited. 3. **Power Electronics:** Dissipating heat from high-speed memory controllers or small FPGAs. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 23.98 | | 400 (2.0 m/s) | 6.31 | | 600 (3.0 m/s) | 4.56 | ---