The **ATS-19F-76-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-19F-76-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height:** 15.00 mm * **Fin Pitch:** Fine Pitch (XC-Cut) --- ### 3. Thermal Performance Thermal resistance determines how effectively the heat sink transfers heat away from the semiconductor junction to the ambient air. | Air Flow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (200 LFM)** | 11.84 | | **Unducted (400 LFM)** | 7.18 | | **Unducted (600 LFM)** | 5.53 | --- ### 4. Key Electronic Features * **Cross-Cut (XC) Fin Design:** The "XC" pattern allows for multi-directional airflow. This is ideal for electronic enclosures where the direction of the system fan might vary or where air turbulence is present. * **Integrated TIM (T766):** The base comes pre-applied with T766 thermal grease. This ensures low thermal contact resistance between the electronic package and the heat sink without requiring manual application. * **Non-Conductive Attachment:** While the push-pins are brass, they are designed to fit through standard PCB mounting holes, ensuring the aluminum heat sink is securely tensioned against the chip without causing electrical shorts on the board surface. --- ### 5. Application Use Cases This specific model is typically found in: * **Telecommunications:** Cooling network switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators that require compact heat dissipation.