The **ATS-19F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-19F-79-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Flow Orientation** | Vertical or Horizontal (depending on mounting) | | **Dimensions** | 25mm x 25mm x 30mm | | **Thermal Resistance** | Approx. 2.63 °C/W (at 200 LFM) | --- ### Key Features and Components #### 1. Push-Pin Attachment System This model features the **pushPIN™** mounting system. - **The Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. - **The Springs:** Compression springs ensure a constant and reliable pressure between the heat sink and the electronic component, which maximizes thermal transfer. #### 2. Cross-Cut Fin Design The "F" in the part number often denotes a specific fin pattern. This heat sink uses a **straight fin or cross-cut design** that increases the surface area exposed to the air, allowing for better heat dissipation through convection. #### 3. Material and Coating - **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodization:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. #### 4. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material** (like high-performance thermal grease or a pad) on the base. This fills microscopic air gaps between the heat sink and the chip to ensure a low-resistance thermal path. --- ### Application in Electronics This part is typically found in: * **Networking Hardware:** Routers, switches, and small-form-factor servers. * **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for a 30mm height. * **Power Electronics:** Voltage regulators or power modules that generate significant heat in a small footprint.