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  • ATS-19F-80-C3-R0

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    The **ATS-19F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in tight spaces with low pressure drop. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Dimensions** | 36.83mm x 36.83mm | | **Height** | 14.50mm | | **Thermal Resistance** | 3.82°C/W @ 200 LFM | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Airflow Direction** | Vertical/Side (maxiFLOW design) | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry The "F" in the part number denotes the maxiFLOW fin pattern. Unlike standard rectangular fins, these have a spread-fin geometry that increases surface area while reducing the resistance to airflow. This makes it ideal for dense PCB layouts where air velocity might be limited. #### B. pushPIN™ Attachment System The **R0** suffix indicates the attachment mechanism. This part uses the **pushPIN™** system which features: * A brass or plastic pin with a high-tension spring. * Precise pressure applied to the thermal interface material (TIM). * Easy installation into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **T412 Chomerics** thermal tape or high-performance grease, ensuring a low-resistance path between the electronic component (CPU, GPU, or ASIC) and the aluminum base. --- ### 3. Application Use-Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed processors in switches and routers. 2. **Embedded Systems:** Industrial PCs where space is constrained but heat generation is high. 3. **Power Electronics:** Cooling of large MOSFET arrays or voltage regulators. --- ### 4. Part Number Breakdown `ATS - 19 F - 80 - C3 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19:** Series Number. * **F:** Fin Type (maxiFLOW). * **80:** Specific dimension/configuration code. * **C3:** Material/Finish (Aluminum / Blue Anodized). * **R0:** Attachment / Revision (pushPIN system).
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ How does blue anodizing affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom fan shroud?