The **ATS-19F-87-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-87-C3-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | XC (Straight Fin) | | **Thermal Resistance** | ~13.00°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 12.7mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 🧩 Key Components & Features ### 1. The Heat Sink Body * **Material:** Made from high-grade aluminum, which offers a balance between thermal conductivity and weight. * **Fin Geometry:** It features a straight-fin design (XC series), optimized for longitudinal airflow. This is ideal for systems where a chassis fan provides a consistent stream of air over the PCB. ### 2. The Mounting System (Push-Pins) * **Mechanism:** Uses a spring-loaded brass push-pin mechanism. * **Advantage:** This ensures consistent pressure across the chip surface, which is critical for maximizing heat transfer. It also allows for tool-free installation into pre-drilled holes in the PCB. ### 3. Thermal Interface Material (TIM) * **Type:** T412. * **Function:** This is a pre-applied phase-change material or adhesive. It fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance at the contact point. ### 4. Surface Treatment * **Blue Anodization:** Beyond aesthetics, the anodized layer provides corrosion resistance and slightly improves radiative heat dissipation. --- ## 📈 Performance Characteristics This heat sink is designed for **low-to-medium profile** applications. Below is a simplified look at its thermal performance relative to airflow: * **Natural Convection:** The performance is lowest here; it relies on rising hot air. * **Forced Airflow (100–500 LFM):** As airflow increases, the thermal resistance drops significantly, allowing the component to remain stable under high processing loads. ---