The **ATS-19F-91-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, designed for thermal management in electronic assemblies. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **maxiFLOW™** series. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-19F-91-C3-R0 | | **Heat Sink Type** | Forged / maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 40mm x 40mm x 10mm (L x W x H) | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | ~6.80°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Physical Design and Construction The component features several distinct engineering characteristics that differentiate it from standard extruded heat sinks: * **maxiFLOW™ Geometry:** The design features a tapered fin structure which increases the surface area for heat dissipation while maintaining a low pressure drop. This is ideal for high-density PCB layouts. * **pushPIN™ Attachment:** Instead of using adhesive tape or epoxy, this unit uses a mechanical push-pin system. This ensures a consistent pressure on the heat source (like a CPU, FPGA, or GPU), optimizing thermal interface performance and allowing for easy removal. * **Material:** It is made of high-quality aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. --- ### 3. Thermal Performance Metrics Thermal resistance determines how effectively the part moves heat away from the silicon. Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **1.0 m/s (200 LFM)** | 6.80 | | **2.0 m/s (400 LFM)** | 3.30 | | **3.0 m/s (600 LFM)** | 2.50 | --- ### 4. Application Use Cases This part is generally used in environments where space is constrained but high thermal reliability is required: * **Networking Hardware:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** High-speed data processing units.