The **ATS-19G-06-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary technical attributes for this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 24.90 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Weight** | ~15.0 grams | --- ### 2. Key Features The ATS-19G-06-C2-R0 utilizes the **pushPIN™** assembly system, which offers several advantages: * **Pre-installed Thermal Interface Material (TIM):** Typically comes with a high-performance thermal pad or phase-change material applied to the base. * **Optimal Fin Design:** Uses a square/rectangular fin array designed to provide high surface area while maintaining low pressure drop. * **Material Construction:** Made from lightweight aluminum for efficient heat conduction and resistance to corrosion via the Blue Anodized finish. * **Compression Springs:** The push-pin mechanism uses a spring-loaded design to ensure even pressure across the component surface, preventing damage during mounting. --- ### 3. Thermal Performance Analysis Thermal resistance varies depending on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 24.90 | | 200 (1.0 m/s) | 12.40 | | 300 (1.5 m/s) | 8.30 | | 400 (2.0 m/s) | 6.50 | --- ### 4. Application Use-Cases * **Embedded Systems:** Ideal for cooling microprocessors in compact industrial boxes. * **Telecommunications:** Used on PCB boards where space is constrained but high heat dissipation is required. * **Networking Gear:** Cooling for routers and switches where active airflow is present.