The **ATS-19G-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.56°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 25.00 mm * **Pitch (E):** 50.00 mm * **Pitch (F):** 50.00 mm * **Weight:** ~50 grams --- ### 3. Key Electronic/Mechanical Features #### A. pushPIN™ Attachment Unlike adhesive-based heat sinks, this model uses a **spring-loaded push-pin** system. This provides: * Consistent pressure across the component for better heat transfer. * Reliable attachment in high-vibration environments. * Easy installation through pre-drilled holes in the PCB. #### B. Fine-Pitch Fin Design The "G" in the part number indicates a specific fin pattern (Cross-Cut). This geometry increases surface area and allows for multi-directional airflow, making it efficient even in systems where the air direction isn't strictly controlled. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal impedance. --- ### 4. Typical Applications This specific size and thermal profile are commonly found in: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Industrial PCs:** Cooling embedded CPUs. 3. **Power Supplies:** Heat dissipation for MOSFETs or IGBTs.