The **ATS-19G-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing the thermal solution directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number encodes specific data regarding its dimensions, thermal performance, and material composition. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-19G-41-C2-R0 | | **Heat Sink Type** | Push Pin (Spring Loaded) | | **Dimensions** | 45mm x 45mm | | **Height (Off Base)** | 22.9mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pins (Brass/Plastic) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design & Geometry The design is optimized for **forced air convection** (systems with fans). * **Fin Style:** It utilizes a **Straight Fin** (or Cross-Cut) pattern. This allows air to flow through the channels, stripping heat away from the aluminum surface area. * **Base Surface:** The bottom surface is machined flat to ensure maximum contact with the electronic component (CPU, FPGA, or GPU). * **Attachment Mechanism:** The "Push Pin" system uses a spring-loaded mechanism. This provides a consistent **clamping force**, which is critical for minimizing the thermal resistance between the chip and the heat sink. --- ### 3. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance** (°C/W). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | ~10.02 | | **200 (Unducted)** | ~4.95 | | **400 (Unducted)** | ~2.80 | --- ### 4. Application and Use Cases This specific part is typically found in: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Embedded Systems:** Industrial PCs or controllers. 3. **Telecommunications:** Base station components. 4. **Power Electronics:** Cooling MOSFETs or power modules. ### 5. Material & Regulatory Compliance * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly increases emissivity for better radiant cooling. * **RoHS Compliant:** The part meets environmental standards for hazardous substances. ---