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  • ATS-19G-52-C2-R0

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    ### Overview of ATS-19G-52-C2-R0 The **ATS-19G-52-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits. --- ### Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (H)** | 25.00mm | | **Thermal Resistance** | 10.79 °C/W (at 100 LFM) | | **Flow Orientation** | Vertical or Horizontal (Fine Pitch) | --- ### Key Components & Design Features #### 1. Heat Sink Body The core is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Fine Pitch" fin design maximizes surface area to increase heat dissipation into the surrounding air. #### 2. pushPIN™ Attachment Unlike adhesive-based cooling, this model uses a **push-pin and spring** assembly. * **Springs:** Usually brass or steel, providing consistent pressure to ensure the thermal interface material (TIM) remains in contact with the heat source. * **Pins:** Designed to snap into pre-drilled holes (typically 3.0mm) on the PCB. #### 3. Thermal Interface Material (TIM) The "R0" suffix often indicates that the unit comes pre-applied with a **Thermal Pad** or high-performance thermal grease. This fills the microscopic air gaps between the chip and the heat sink base. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, aiding in heat radiation. --- ### Mechanical Drawing Representation If you are integrating this into a CAD model, the hole spacing is critical: ```text 35.00mm [L] <---------------> +---------------+ ^ | (Pin) | | | | | 35.00mm [W] | (Pin) | | +---------------+ v Hole Spacing: 40.00mm (Diagonal) ``` ---
    ✨ Follow-up Questions
    • ⤷ What is the maximum TDP (Thermal Design Power) this heat sink can handle?
    • ⤷ Are there alternative attachment methods for the ATS-19G series if my PCB lacks holes?
    • ⤷ How does the thermal resistance change as airflow (LFM) increases?