ATS-19G-52-C2-R0
AI

### Overview of ATS-19G-52-C2-R0
The **ATS-19G-52-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits.
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### Technical Specifications
The following table outlines the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Body), Blue Anodized (Finish) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height (H)** | 25.00mm |
| **Thermal Resistance** | 10.79 °C/W (at 100 LFM) |
| **Flow Orientation** | Vertical or Horizontal (Fine Pitch) |
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### Key Components & Design Features
#### 1. Heat Sink Body
The core is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Fine Pitch" fin design maximizes surface area to increase heat dissipation into the surrounding air.
#### 2. pushPIN™ Attachment
Unlike adhesive-based cooling, this model uses a **push-pin and spring** assembly.
* **Springs:** Usually brass or steel, providing consistent pressure to ensure the thermal interface material (TIM) remains in contact with the heat source.
* **Pins:** Designed to snap into pre-drilled holes (typically 3.0mm) on the PCB.
#### 3. Thermal Interface Material (TIM)
The "R0" suffix often indicates that the unit comes pre-applied with a **Thermal Pad** or high-performance thermal grease. This fills the microscopic air gaps between the chip and the heat sink base.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, aiding in heat radiation.
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### Mechanical Drawing Representation
If you are integrating this into a CAD model, the hole spacing is critical:
```text
35.00mm [L]
<--------------->
+---------------+ ^
| (Pin) | |
| | | 35.00mm [W]
| (Pin) | |
+---------------+ v
Hole Spacing: 40.00mm (Diagonal)
```
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- ⤷
What is the maximum TDP (Thermal Design Power) this heat sink can handle?
- ⤷ Are there alternative attachment methods for the ATS-19G series if my PCB lacks holes?
- ⤷ How does the thermal resistance change as airflow (LFM) increases?