The **ATS-19G-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.32°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Weight** | 46.0 Grams | --- ### 2. Key Design Features * **Fin Profile (Square Fin):** The "63" series typically utilizes a square fin design which provides a large surface area for heat exchange while maintaining structural integrity. * **pushPIN™ Attachment:** This model uses a tool-free push-pin system with a pre-assembled compression spring. This ensures consistent pressure between the heat sink and the component, optimizing thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with a high-performance **Phase Change Material** or thermal grease pre-applied to the base, simplifying the assembly process. * **Material Efficiency:** Made from extruded aluminum (AL6063), it offers a balance of lightweight properties and high thermal conductivity. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** Cooling of networking chips and high-speed routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power conversion modules. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 12.32 | 4.26 | 2.42 | 1.74 | 1.41 |